(NOTE: Each chapter concludes with Summary, References, and
Problems.)
Preface.
1. An Overview of Microelectronic Fabrication.
A Historical Perspective. An Overview of Monolithic Fabrication
Processes and Structures. Metal-Oxide-Semiconductor (MOS)
Processes. Basic Bipolar Processing. Safety.
2. Lithography.
The Photolithographic Process. Etching Techniques. Photomask
Fabrication. Exposure Systems. Exposure Sources. Optical and
Electron Microscopy. Further Reading.
3. Thermal Oxidation of Silicon.
The Oxidation Process. Modeling Oxidation. Factors Influencing
Oxidation Rate. Dopant Redistribution During Oxidation. Masking
Properties of Silicon Dioxide. Technology of Oxidation. Oxide
Quality. Selective Oxidation and Shallow Trench Formation. Oxide
Thickness Characterization. Process Simulation.
4. Diffusion.
The Diffusion Process. Mathematical Model for Diffusion. The
Diffusion Coefficient. Successive Diffusions. Solid-Solubility
Limits. Junction Formation and Characterization. Sheet Resistance.
Generation-Depth and Impurity Profile Measurement. Diffusion
Simulation. Diffusion Systems. Gettering.
5. Ion Implantation.
Implantation Technology. Mathematical Model for Ion Implantation.
Selective Implantation. Junction Depth and Sheet Resistance.
Channeling, Lattice Damage, and Annealing. Shallow Implantation.
Source Listing
6. Film Deposition.
Evaporation. Sputtering. Chemical Vapor Deposition. Epitaxy.
Further Reading.
7. Interconnections and Contacts.
Interconnections in Integrated Circuits. Metal Interconnections and
Contact Technology. Diffused Interconnections. Polysilicon
Interconnections and Buried Contacts. Silicides and
Multilayer-Contact Technology. The Liftoff Process. Multilevel
Metallization. Copper Interconnects and Damascene Processes.
Further Reading.
8. Packaging and Yield.
Testing. Wafer Thinning and Die Separation. Die Attachment. Wire
Bonding. Packages. Flip-Chip and Tape-Automated-Bonding Processes.
Yield. Further Reading.
9. MOS Process Integration.
Basic MOS Device Considerations. MOS Transistor Layout and Design
Rules. Complementary MOS (CMOS) Technology. Silicon on
Insulator.
10. Bipolar Process Integration.
The Junction-Isolated Structure. Current Gain. Transit Time.
Basewidth. Breakdown Voltages. Other Elements in SBC Technology.
Layout Considerations. Advanced Bipolar Structures. Other Bipolar
Isolation Techniques. BICMOS.
11. Processes for Microelectromechanical Systems—MEMS.
Mechanical Properties of Silicon. Bulk Micromachining. Silicon
Etchants. Surface Micromachining. High-Aspect-Ratio Micromachining:
The LIGA Molding Process. Silicon Wafer Bonding. IC Process
Compatibility.
Answers to Selected Problems.
Index.
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